Title:
EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3871025
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing which is excellent in workability and fluidity and gives a lead-free cured item excellent in flame retardancy and solder crack resistance even when a halogenated epoxy resin and an antimony compound are not contained.
SOLUTION: This epoxy resin composition essentially contains (A) a modified epoxy resin prepared by glycidylating a mixture of 4,4'-biphenol and a phenol resin represented by formula (1), (B) a phenol resin represented by formula (1) and/or a phenol resin represented by formula (2), (C) a cure accelerator, and (D) an inorganic filler.
Inventors:
Kimura Yasuo
Kazutoshi Tomiyoshi
Takayuki Aoki
Eiichi Asano
Taro Shimoda
Toshio Shiobara
Kazutoshi Tomiyoshi
Takayuki Aoki
Eiichi Asano
Taro Shimoda
Toshio Shiobara
Application Number:
JP2001216735A
Publication Date:
January 24, 2007
Filing Date:
July 17, 2001
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08G59/20; C08K9/02; C08G59/62; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08G59/20; C08G59/62; C08K9/02; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP10338735A | ||||
| JP6009595A | ||||
| JP11302501A | ||||
| JP2000230111A |
Attorney, Agent or Firm:
Takashi Kojima
Yuko Nishikawa
Yuko Nishikawa
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