To provide an epoxy resin composition useful as e.g. an adhesive for an insulating resin layer of a build-up multilayer printed-wiring board, and an adhesive for connecting a semiconductor element to a substrate, a film adhesive, and a cure material.
The epoxy resin composition contains (A) an epoxy resin, (B) a curing agent, (C) a phenoxy resin, (D) a rubber component, and (E) a cure accelerator, wherein the curing agent (B) comprises a polyhydroxy resin represented by HO-A-[-CR2-Z-CR2-A(OH)-]n-H (wherein A is a benzene ring or a naphthalene ring; and Z is phenylene or biphenylene), the component (C) comprises a bisphenol A or F phenoxy resin, the component (D) comprises an elastomer obtained by the polycondensation of an aromatic polyamide oligomer having terminal amino groups with a butadiene/acrylonitrile copolymer having terminal carboxyl groups, and the content of the phenoxy resin and the elastomer are each 5-50 wt.%.
YAMASHITA TOKUO
KAWASATO HIRONOBU
