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Patent Searching and Data


Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2010270204
Kind Code:
A
Abstract:

To provide an epoxy resin composition excellent in adhesion performance and flexibility not only in a range from a low temperature (about -20°C) to room temperature but at a high temperature (about 80°C) and preferably usable as a structural adhesive.

The epoxy resin composition contains an epoxy resin (A) and core-shell type rubber particles (B), wherein the epoxy resin (A) contains a urethane-modified epoxy resin and/or a rubber-modified epoxy resin, the core-shell type rubber particles (B) have a structure having at least three layers, that is, a core layer, an intermediate layer and a shell layer, and the core-shell type rubber particles (B) are surface-modified with an epoxy group and/or a functional group which reacts with an epoxy group.


Inventors:
SATO NAO
ISHIKAWA KAZUNORI
Application Number:
JP2009122152A
Publication Date:
December 02, 2010
Filing Date:
May 20, 2009
Export Citation:
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Assignee:
YOKOHAMA RUBBER CO LTD
International Classes:
C08L63/00; C08L21/00; C09J121/00; C09J151/04; C09J163/00; C09J175/04
Attorney, Agent or Firm:
Nozomi Watanabe
Haruko Sanwa