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Patent Searching and Data


Title:
プラズマ処理システムにおける改良されたベローズシールドのための装置
Document Type and Number:
Japanese Patent JP4627659
Kind Code:
B2
Abstract:
The present invention presents an improved bellows shield for a plasma processing system, wherein the design and fabrication of the bellows shield coupled to a substrate holder electrode advantageously provides protection of a bellows with substantially minimal erosion of the bellows shield.

Inventors:
Hidehito Saegusa
Takase Hitoshi
Yasushi Mihashi
Hiroyuki Nakayama
Application Number:
JP2004539374A
Publication Date:
February 09, 2011
Filing Date:
September 29, 2003
Export Citation:
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Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/3065; C23F4/00; H01J37/00; H01J37/02; H01J37/32; H01L21/00; H01L21/306
Domestic Patent References:
JP7321097A
JP11317397A
JP2001226773A
JP2004526053A
Attorney, Agent or Firm:
Kurata Masatoshi
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Katsumura Hiro
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori
Takuzo Ichihara
Yamashita Gen