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Patent Searching and Data


Title:
EQUIPMENT AND METHOD FOR COMPONENT MOUNTING
Document Type and Number:
Japanese Patent JP2005005415
Kind Code:
A
Abstract:

To provide component mounting equipment and a component mounting method wherein components of broad types containing minute components are sucked simultaneously and can be mounted at high speed, so that the flexibility of manufacturing is improved.

Negative pressure generators (50) and positive/negative pressure changeover parts (70) are arranged in a plurality of mounting heads (10) which are endlessly connected to a belt (3) and subjected to intermittent wrap-around drive between a component extraction position and a component mounting position, and the suction and simultaneous extraction of the components are enabled with a plurality of mounting nozzles (31) existing in the mounting heads (10). In the negative pressure generator (50), an undulating cam trench (24) is used, pistons (53) are moved in an alternate direction at the inside of piston chambers (51) of the mounting heads (10), and negative pressure is generated and accumulated inside negative pressure chambers (52). Negative pressure is shared by all of the mounting heads (10) of the belt (3). The positive/negative pressure changeover part (70) is constituted of a rotary cam which changes the vertical movement of the mounting nozzle (31) into rotational movement and switches valves of positive/negative pressure.


Inventors:
WATANABE HIDEAKI
IMAI SEI
HIRAI WATARU
Application Number:
JP2003166003A
Publication Date:
January 06, 2005
Filing Date:
June 11, 2003
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H05K13/04; (IPC1-7): H05K13/04
Attorney, Agent or Firm:
Osamu Kawamiya
Takuji Yamada