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Title:
EVAPORATIVE COOLING DEVICE
Document Type and Number:
Japanese Patent JP2006258315
Kind Code:
A
Abstract:

To provide a evaporative cooling device capable of uniformly and efficiently evaporatively cooling a whole of an article to be cooled.

A cooling fluid conduit 6 is provided in a jacket part 2 of a reaction pot 1. A plurality of cooling fluid spraying ports not shown are provided on the cooling fluid conduit 6 and one end of a cooling fluid feeding pipe 5 is connected to it. The other end of the cooling fluid feeding pipe 5 is connected to a part of a circulation passage 15 of a combined vacuum pump 4. When the reaction pot 1 is cooled, the cooling fluid is fed to the whole of the reaction pot 1 by spraying the cooling fluid from the cooling fluid feeding pipe 5 and the cooling fluid conduit 6 into the jacket part 2. Thereby, the reaction pot 1 can be evaporatively cooled without unevenness.


Inventors:
MORII TAKAYUKI
Application Number:
JP2005072720A
Publication Date:
September 28, 2006
Filing Date:
March 15, 2005
Export Citation:
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Assignee:
TLV CO LTD
International Classes:
F25D9/00; F28D5/00
Domestic Patent References:
JP2003004353A2003-01-08
JPH04137736U1992-12-22



 
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