Title:
フィラメントカセットおよび装填システム
Document Type and Number:
Japanese Patent JP4107960
Kind Code:
B2
Abstract:
The present invention is a method and apparatus for building three-dimensional models by deposition modeling techniques from moisture-sensitive thermoplastics. A feedstock of thermoplastic modeling material is dried to a low moisture content and supplied to a dispensing head of a modeling apparatus. The dry thermoplastic material is heated in a liquifier and deposited in a predetermined pattern so as to build a three-dimensional model.
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Inventors:
Swanson, William John
Popa, Minnea Ay.
Tarley, Patrick W.
Pledeman, William Earl. Junior
Hopkins, Paul Lee.
Broads, steve
Kim, Daniel Eye.
Pollard, David Elle.
Hearne, Andrew M.
Popa, Minnea Ay.
Tarley, Patrick W.
Pledeman, William Earl. Junior
Hopkins, Paul Lee.
Broads, steve
Kim, Daniel Eye.
Pollard, David Elle.
Hearne, Andrew M.
Application Number:
JP2002511950A
Publication Date:
June 25, 2008
Filing Date:
July 12, 2001
Export Citation:
Assignee:
STRATASYS, INC.
International Classes:
B29C31/00; B29C41/36; B29C67/00; C08K5/00; B29C41/52; B29C71/02
Foreign References:
| US6022207 | ||||
| US6027068 |
Attorney, Agent or Firm:
Nagoya International Patent Service Corporation
Hidesaku Yamamoto
Hidesaku Yamamoto