Title:
FILM-FORMING MATERIAL FOR LITHOGRAPHY, FILM-FORMING COMPOSITION FOR LITHOGRAPHY, UNDERLAY FILM FOR LITHOGRAPHY AND PATTERNING METHOD
Document Type and Number:
Japanese Patent JP2019200244
Kind Code:
A
Abstract:
To provide a film-forming material for lithography or the like that can employ a wet process and is useful for forming a photoresist underlay film having excellent heat resistance, etching resistance, step substrate embedding properties and film surface smoothness.SOLUTION: A film-forming material for lithography has an oxazine compound.SELECTED DRAWING: None
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Inventors:
HORIUCHI ATSUYA
MAKINOSHIMA TAKASHI
ECHIGO MASATOSHI
MAKINOSHIMA TAKASHI
ECHIGO MASATOSHI
Application Number:
JP2018093295A
Publication Date:
November 21, 2019
Filing Date:
May 14, 2018
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO
International Classes:
G03F7/11; C08G14/073; C08G14/12; G03F7/20; G03F7/26
Domestic Patent References:
| JP2009222923A | 2009-10-01 |
Foreign References:
| WO2018016640A1 | 2018-01-25 | |||
| WO2018051930A1 | 2018-03-22 | |||
| WO2013115097A1 | 2013-08-08 | |||
| WO2018016615A1 | 2018-01-25 | |||
| CN101463106A | 2009-06-24 | |||
| EP2263874A1 | 2010-12-22 |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Kazuhiko Naito
Toshifumi Onuki
Kazuhiko Naito