Title:
FILM PASTING METHOD
Document Type and Number:
Japanese Patent JP3714813
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To eliminate the contamination of a substrate due to film cutting by providing a perforation in width direction relative to a film main body which is to be pasted, and peeling a cover film of the film main body which is to be pasted to a substrate along the perforation before the main body is pasted to the substrate.
SOLUTION: Related to pasting of a resist film 5 to a substrate 1, firstly a film F is delivered from a roll 3 and a perforation M is formed on the film F by a perforation forming unit 7. A cover film 6 is peeled after the perforation M is formed. Related to the substrate 1 after pasting, the substrates are pulled in the transportation direction or in the direction diagonal to it in the lower stream of a transportation path, so that the film F is cut at such perforation M where tooth length is longer for separation from each other. A base film 4 is peeled from the substrate 1 at use. Thus, no film cutting contaminates the substrate while the film main body is accurately pasted to a base body.
Inventors:
Fumiaki Numajiri
Eiichi Hyakuchi
Takehiko Hayashi
Eiichi Hyakuchi
Takehiko Hayashi
Application Number:
JP1327699A
Publication Date:
November 09, 2005
Filing Date:
January 21, 1999
Export Citation:
Assignee:
Hitachi Industries Co., Ltd.
International Classes:
H01L21/683; C09J5/00; G03F7/004; H01L21/68; (IPC1-7): H01L21/68
Domestic Patent References:
| JP9174797A | ||||
| JP9208909A | ||||
| JP2000211085A |
Attorney, Agent or Firm:
Yukihiko Takada
Masaru Takenouchi
Masaru Takenouchi