To provide a film for sealing having a protective function and a filling property which is used for protecting and filling a semiconductor chip and whose filling property is improved by controlling flowability during filling, and also to provide a semiconductor device using the same.
The film for sealing has a resin layer that contains (A) a resin containing a polymer component containing a crosslinkable functional group and having a weight average molecular weight of 100,000 and a Tg of -50-50C, and a thermosetting component mainly composed of an epoxy resin, (B) a filler having an average particle diameter of 1-30 m and (C) a coloring agent. The film for sealing has a viscosity at 50-100C as determined by thermosetting viscoelasticity measurement of the film in the stage B of 10,000-100,000 Pa s.
TAKEMORI DAICHI
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| JP2008133468A | 2008-06-12 |
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
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