Title:
指紋認識モジュール及びその作製方法並びに電子装置
Document Type and Number:
Japanese Patent JP7456943
Kind Code:
B2
Abstract:
A fingerprint identification module and a manufacturing method therefor, and an electronic apparatus. The fingerprint identification module comprises a substrate, a piezoelectric material layer, an auxiliary structure and a plurality of first driving electrodes. The piezoelectric material layer is disposed on the substrate, the auxiliary structure is at least in part disposed on the substrate, and the plurality of first driving electrodes are disposed on the piezoelectric material and the auxiliary structure on the side away from the substrate. Each first driving electrode extends along a first direction and passes a first edge of the piezoelectric material layer in the first direction, the plurality of first driving electrodes are arranged at intervals in a second direction, and the auxiliary structure is in contact at least with the first edge and comprises a slope portion, the thickness of the slope portion in the direction perpendicular to the functional substrate being reduced gradually from the first edge in the direction away from the center of the piezoelectric material layer. The problems of wire breaking, residual conducting materials and so on are avoided in the process of forming the plurality of first driving electrodes on the piezoelectric material layer in the fingerprint identification module, so that product yield can be improved.
Inventors:
Liu Wenchu
Rishufon
Yao Chi
Janfon
Don Lee Wen
Tsui Jao
Schuan Sian
Mondeathen
Song Shio Shin
One Rebuo
Yue Yang
Hou Dong Fay
Ryu Ji Jun
Rishufon
Yao Chi
Janfon
Don Lee Wen
Tsui Jao
Schuan Sian
Mondeathen
Song Shio Shin
One Rebuo
Yue Yang
Hou Dong Fay
Ryu Ji Jun
Application Number:
JP2020564385A
Publication Date:
March 27, 2024
Filing Date:
January 17, 2020
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO.,LTD.
International Classes:
H04R17/00; H04R31/00
Domestic Patent References:
| JP2007336684A | ||||
| JP2007510301A | ||||
| JP2012009148A | ||||
| JP2018170343A |
Foreign References:
| CN108921074A |
Attorney, Agent or Firm:
Patent Attorney Corporation Eiko Office