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Title:
FLASH MEMORY DEVICE HAVING THREE-DIMENSIONAL STRUCTURE WITH IMPROVED DRIVING SYSTEM, AND METHOD OF DRIVING THE SAME
Document Type and Number:
Japanese Patent JP2008310949
Kind Code:
A
Abstract:

To provide a flash memory device capable of improving an integrating degree and performance for driving the device, and a method of driving the same.

This flash memory device is equipped with a plurality of layers each arranged stacked vertically with a plurality of layers includes a plurality of memory cells, and a row decoder which is electrically coupled to the plurality of layers and supplies a wordline voltage to the plurality of layers. The device is characterized in that memory cells provided in at least two layers out of the plurality of layers are set in one block and the wordlines associated with the memory cells provided in at least the two layers are electrically coupled.


Inventors:
KIM DOO-GON
PARK KI-TAE
LEE YEONG-TAEK
Application Number:
JP2008153155A
Publication Date:
December 25, 2008
Filing Date:
June 11, 2008
Export Citation:
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Assignee:
SAMSUNG ELECTRONICS CO LTD
International Classes:
G11C16/02; G11C16/04; G11C16/06; H01L21/8247; H01L27/115; H01L29/788; H01L29/792
Domestic Patent References:
JP2008192708A2008-08-21
Other References:
JPN6012049756; Soon-Moon Jung, et al: 'Three Dimensionally Stacked NAND Flash Memory Technology Using Stacking Single Crystal Si Layers on' Electron Devices Meeting, 2006. IEDM '06. International , 20061211, P.1-4, IEEE
JPN6012049758; Ki-Tae Park, et al: 'A 45nm 4Gb 3-Dimentional Double-Stacked Multi-level NAND Flash Memory with Shared Bitline Structure' Solid-State Circuits Conference, 2008. ISSCC 2008. Digest of Technical Papers. IEEE International , 20080203, P.510,511,632, IEEE
Attorney, Agent or Firm:
Makoto Hagiwara