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Title:
FLUORINATED PHOTOSENSITIVE POLYMER HAVING ETHYLENE GLYCOL GROUP AND CHEMICAL AMPLIFICATION TYPE RESIST COMPOSITION CONTAINING THE SAME
Document Type and Number:
Japanese Patent JP2008179824
Kind Code:
A
Abstract:

To provide a photosensitive polymer which upgrades the characteristics, such as transmittance and resistance to dry etching, of a resist composition, thus enabling still more detailed pattern formation.

The photosensitive polymer has a structural formula represented by the figure. In the formula, R1 is a hydrogen atom or a methyl group; R2 is a 3-10C hydrocarbon group having a fluorinated ethylene glycol group; R6 is a hydrogen atom or a 1-20C hydrocarbon group; and R7 and R8 are each a hydrogen atom or a hydroxy, nitrile, 1-10C alkyl, 1-10C fluoroalkyl, alkoxy, or ester group.


Inventors:
SANG-JUN CHOI
MOON JU-TAE
WOO SANG-GYUN
YOON KWANG-SUB
SONG KI-YONG
Application Number:
JP2008050069A
Publication Date:
August 07, 2008
Filing Date:
February 29, 2008
Export Citation:
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Assignee:
SAMSUNG ELECTRONICS CO LTD
International Classes:
C08F220/36; C08F20/26; C08F212/14; C08F220/10; C08F220/42; C08F232/04; G03F7/004; G03F7/039; H01L21/027
Domestic Patent References:
JPS6424815A1989-01-26
Attorney, Agent or Firm:
Mikio Hatta
Yasuo Nara
Katsuyuki Utani