To provide a heat-melting fluororesin laminate which shows outstanding heat resistance, low moisture absorption characteristics, high dielectric properties, high strength, low linear expansion coefficient and low shrinkage factor and is free from the anisotropy of these physical properties and further, is best-suited as a material for a circuit substrate.

This laminate includes at least two fluororesin sheet layers containing a liquid crystal polymer orientated, in a fibrous fashion, in a heat- melting fluororesin, at least two layers of the fluororesin sheet layers showing a mutually different orientation direction of the liquid crystal polymer. In addition, the laminate is composed of an anisotropic heat-resistant resin sheet and a fluororesin sheet, or the laminate is composed of the heat-melting fluororesin sheet laminated on a woven fabric, a nonwoven fabric or a knitted cloth of the heat-melting fluororesin fiber including the liquid crystal polymer fibrously orientated.

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