Title:
フラックス及びソルダペースト
Document Type and Number:
Japanese Patent JP6993594
Kind Code:
B2
Abstract:
The present invention provides: a flux which is capable of suppressing the occurrence of a void; and a solder paste which uses this flux. This flux contains rosin, an activator and a solvent; the solvent contains a monoalkylene glycol solvent and a solid solvent that is in a solid state at 20°C; the total content of the monoalkylene glycol solvent and the solid solvent is from 40% by mass to 60% by mass if the total amount of the flux is taken as 100; and the solid solvent is contained therein in an amount of from 5% by mass to 25% by mass.
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Inventors:
Cormorant fishing
Kazuya Kitazawa
Hiroaki Kawamata
Shinji Kikuchi
Keisuke Shinozaki
Kazuya Kitazawa
Hiroaki Kawamata
Shinji Kikuchi
Keisuke Shinozaki
Application Number:
JP2020058267A
Publication Date:
February 04, 2022
Filing Date:
March 27, 2020
Export Citation:
Assignee:
Senju Metal Industry Co., Ltd.
International Classes:
B23K35/363
Domestic Patent References:
| JP2019042805A | ||||
| JP2018161674A | ||||
| JP2019093433A | ||||
| JP2019069467A | ||||
| JP2019084549A | ||||
| JP2017064758A |
Attorney, Agent or Firm:
Yamaguchi International Patent Office