To provide a foreign matter removal method which enables the removal of a charged foreign matter on a wiring membrane especially in the TFT step without injuring the surface of the substrate and to provide its apparatus.

The foreign matter removal method comprises a step of aligning the position so that the spacer arranged at the fixed point on the press member via a cohesive layer is not overlapped with the wiring pattern on the substrate, a step of bringing the press member into contact with the substrate by a predetermined pressure and a step of attaching the charged foreign matter on the wiring membrane to remove it by the cohesive layer.