Title:
FORMATION OF BUMP
Document Type and Number:
Japanese Patent JP3156483
Kind Code:
B2
Abstract:
PURPOSE: To provide a method of the formation of bumps wherein cream solder is applied to the electrodes on a board and is melted by heating, and wherein the generation of bridges is prevented with reliability and well-shaped bumps are obtained.
CONSTITUTION: Cream solder 3 is applied to the electrodes 2 on a board 1 by screen printing. The board 1 is then turned over to make the surface coated with cream solder 3 face downward. The board 1 is heated to melt the cream solder 3, which is then cooled and hardened. Since the board 1 is turned over and thus the cream solder 3 is facing downward when melted, the melted cream solder 3 sags by gravity. This prevents cream solder 3 from flowing sideward and getting mixed up with that on the adjacent electrodes, and makes it possible to form bumps 3a, isolated from one another, on electrodes 2 with reliability.
Inventors:
Tadahiko Sakai
Application Number:
JP114394A
Publication Date:
April 16, 2001
Filing Date:
January 11, 1994
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H05K3/34; H01L21/321; H01L21/60; (IPC1-7): H01L21/60; H05K3/34
Domestic Patent References:
| JP730014A | ||||
| JP6232134A | ||||
| JP5326524A | ||||
| JP590271A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)