To provide a coating film forming method and a coating device, which are capable of uniformalizing the thickness of a coating film formed on a substrate and decreasing the quantity of a coating liquid to be used to the utmost.

The coating film is formed by discharging the coating liquid on the surface of the substrate from a coating liquid feed nozzle 80 while moving the coating liquid feed nozzle 80 above the substrate. In such a case, one or more of the discharge and the discharge rate of the coating liquid from the coating liquid feed nozzle 80, the movement and the moving speed of the coating liquid feed nozzle 80 and the rotation and the rotational speed of the substrate are properly controlled at the time of moving the coating liquid supply nozzle 80 above the substrate.