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Title:
FORMATION OF HEAT-INSULATING SYNTHETIC WOODEN BOARD
Document Type and Number:
Japanese Patent JPS60229709
Kind Code:
A
Abstract:

PURPOSE: To prevent the warping of a molding when swelled by a method in which cellulosic short fibers are pressed temporarily to form a pressed board, an adhesive is coated on the surface of the pressed board, and the pressed board is sufficiently pressed for molding.

CONSTITUTION: Cellulosic base material (e.g., wood chips, pulp, etc.) is dried impregnated with an urea resin liquid within 5W20°/wt%. The base material so treated is allowed to stand for 20W30min and dried by heating to form an aggregate 1. A material formed by mixing the aggregate 1 and fibers 2 or the material with a net cloth 3 is temporarily hot- or cold-pressed to cause the integral adherence of the aggregates 1, the entanglement of the fibers 2 and the net cloth 3. Since given heat-insulating spaces are formed among the aggregates 1 and swelling and absorption spaces for the swelling, the aggregate 1 are formed in the raising portions 1a, the heat-insulating effects of the synthetic wooden board can be enhanced.


Inventors:
NISHIBORI SADAO
Application Number:
JP8409584A
Publication Date:
November 15, 1985
Filing Date:
April 27, 1984
Export Citation:
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Assignee:
AIN ENGINEERING KK
International Classes:
B27N3/04; B27N3/06; B27N3/10; (IPC1-7): B27N3/06
Domestic Patent References:
JPS51112884A1976-10-05
JPS5772804A1982-05-07
JP38006634A
Attorney, Agent or Firm:
Minoru Kuwahara