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Title:
GLASS FIBER WOVEN TEXTILE FOR PRINTED-WIRING BOARD
Document Type and Number:
Japanese Patent JPH0974255
Kind Code:
A
Abstract:

To make it possible to obtain a glass fiber woven textile, which can obtain a low dielectric constant and a low dielectric loss tangent as the material for a printed-wiring board and is superior also in durability and drill processability, by a method wherein the woven textile is woven of a glass fiber having a specified composition.

A glass fiber woven textile for printed-wiring board use is woven of a glass fiber having a composition of SiO2: 50 to 60% Al2O3: 10 to 20% B2O3: 20 to 30% CaO: 0 to 5% MgO: 0 to 74%, Li2O+Na2O+K2O: 0 to 0.5% and TiO2: 0.5 to 5% at wt.%. Accordingly, the printed-wiring board, which is obtained using such the glass fiber, has a low dielectric constant and a low dielectric loss tangent. In particular, the glass fiber woven textile is superior as a glass fiber woven textile for high-density circuit use printed-wiring board use. Moreover, the glass fiber woven textile is superior also in water resistance, soldering temperature resistance and chemical resistance and hardly causes a separation from a resin constituting the printed-wiring board at the time of heat load. Moreover, as perforating positions on the woven textile are hardly crumbled also in a drill processability and the wear due to a drill is little, the reliability of the woven textile is high.


Inventors:
MATSUMOTO KOICHI
SUZUKI YOSHIHARU
TAMURA SHINICHI
MORI MASAHIRO
Application Number:
JP19160296A
Publication Date:
March 18, 1997
Filing Date:
July 03, 1996
Export Citation:
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Assignee:
NITTO BOSEKI CO LTD
NITTO GLASS FIBER MFG
International Classes:
B32B17/04; C03B37/14; C03C3/091; D01F9/08; D03D1/00; D03D15/12; H05K1/03; (IPC1-7): H05K1/03; C03B37/14; C03C3/091; D03D1/00; D03D15/12