Title:
地表面温調装置
Document Type and Number:
Japanese Patent JP6654906
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To alleviate a burden of work for bending a bent pipe part of a temperature control pipe for a ground surface temperature control device.SOLUTION: A temperature control pipe 20 of a ground surface temperature control device 1 is buried under a ground surface 9d. A pair of straight pipe parts 24 and 24 of the temperature control pipe 20 are linearly extended along the ground surface 9d. The straight pipe parts 24 and 24 are joined together via a bent pipe part 22. A connecting pipe part 25 is provided between the straight pipe part 24 and the bent pipe 22. The connecting pipe part 25 is inclined to the opposite side of the other straight pipe part toward the bent pipe part 22 from the straight pipe part 24.SELECTED DRAWING: Figure 6
Inventors:
Tomokazu Hagino
Ryosuke Ito
Masakazu Mikamori
Yuki Ujie
Yutaka Kinpira
Ryosuke Ito
Masakazu Mikamori
Yuki Ujie
Yutaka Kinpira
Application Number:
JP2016006468A
Publication Date:
February 26, 2020
Filing Date:
January 15, 2016
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
E01C11/26
Domestic Patent References:
| JP7109704A | ||||
| JP2015218983A | ||||
| JP6193008A | ||||
| JP6220808A | ||||
| JP2002061101A |
Foreign References:
| US5327737 |
Attorney, Agent or Firm:
Noboru Watanabe
Harada Sanjugi
Tetsumi Aono
Harada Sanjugi
Tetsumi Aono