Title:
HEAT CONDUCTING SHEET AND ITS PRODUCTION
Document Type and Number:
Japanese Patent JP3474839
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a heat conducting sheet improved in heat conductivity by filling a thermal conductive filler in a large amount and a method for producing the heat conducting sheet.
SOLUTION: An experiment is carried out by filling a thermal conductive filler (e.g. silicon carbide) having various particle sizes, kneading and forming the same. The result shows that a remarkably high filling rate is attained by filling the thermal conductive filler by mixing fillers having larger and smaller average particle sizes. The reason is estimated almost as follows. When the thermal conductive filler solely comprises larger particles 1, there are spaces among the particles (B). On the other hand, when larger particles 1 and smaller particles 2 are used by mixing them, the spaces among the larger particles are occupied by the smaller particles 2, thus the filling rate is improved (A). A large number of the thermal conductive filler is filled by using a mixture obtained by mixing those having the larger particle size and the smaller particle size.
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Inventors:
Akio Yamaguchi
Yasuhiro Kawaguchi
Yasuhiro Kawaguchi
Application Number:
JP2000265377A
Publication Date:
December 08, 2003
Filing Date:
September 01, 2000
Export Citation:
Assignee:
Kitagawa Industry Co., Ltd.
International Classes:
C08J5/18; C08K3/34; C08K7/00; C08L21/00; C08L83/04; C09K5/08; H01F27/22; (IPC1-7): C08L21/00; C08K3/34; C08K7/00; C08L83/04
Domestic Patent References:
| JP216135A | ||||
| JP2000233452A |
Attorney, Agent or Firm:
Tsutomu Adachi (1 person outside)