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Title:
HEAT-CONDUCTIVE THERMOSETTING ADHESIVE COMPOSITION AND HEAT-CONDUCTIVE THERMOSETTING ADHESIVE SHEET
Document Type and Number:
Japanese Patent JP2013249391
Kind Code:
A
Abstract:

To provide a heat-conductive thermosetting adhesive composition and a heat-conductive thermosetting adhesive sheet having excellent heat conductivity (≥0.2 w/m×k as thermal conductivity coefficient), small thermal deterioration tendency and high insulation property and, nevertheless, having excellent processability.

There is provided a heat-conductive thermosetting adhesive composition including a polyimide resin, an epoxy resin, a curing agent and a heat-conductive filler, wherein at least one of the resins contains a silicone skeleton, the lowest viscosity temperature of the composition on a melt viscosity curve under heating is 130-230°C and the lowest viscosity on the curve is ≥20,000 poises; and there is also provided an adhesive sheet produced by using the composition.


Inventors:
TOCHIHIRA JUN
HORIIE TAKAYUKI
YAMADA HIROMI
MORI TAKAHIRO
Application Number:
JP2012125424A
Publication Date:
December 12, 2013
Filing Date:
May 31, 2012
Export Citation:
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Assignee:
TOMOEGAWA PAPER CO LTD
International Classes:
C09J179/08; C09J7/00; C09J11/02; C09J163/00; C09J183/10; C09K5/08
Domestic Patent References:
JP2009275229A2009-11-26
JP2009084563A2009-04-23
JP2011195674A2011-10-06
JPH05311144A1993-11-22
JP2009290165A2009-12-10
Foreign References:
WO2008143253A12008-11-27



 
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