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Title:
THERMOSETTING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2013249390
Kind Code:
A
Abstract:

To provide a thermosetting resin composition excellent in thermal conductivity and workability, and to provide a semiconductor device excellent in reliability.

There is provided a thermosetting resin composition for bonding a semiconductor device to a substrate. The composition includes thermoconductive particles, and satisfies D<6 μm when d50 in volume-based particle size distribution of the thermoconductive particle by a flow type particle image analyzer is defined as D1, d50 in number-based particle size distribution by the above image analyzer as D2, and a value subtracting D2 from D1 is defined as D.


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Inventors:
MURAYAMA RYUICHI
SHIMOBE YASUO
MITSUTODE KEIJI
Application Number:
JP2012125388A
Publication Date:
December 12, 2013
Filing Date:
May 31, 2012
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
C09J201/00; C09J11/04; H01L21/52
Domestic Patent References:
JP2008231335A2008-10-02
JP2011225856A2011-11-10
JP2009013294A2009-01-22
JP2010267721A2010-11-25
Foreign References:
WO2012063747A12012-05-18
WO2012133767A12012-10-04



 
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