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Title:
HEAT CURABLE ADHESIVE
Document Type and Number:
Japanese Patent JPS51132231
Kind Code:
A
Abstract:

PURPOSE: A heat curable adhesive for metal which has excellent thermal resistance and adhesiveness.


Inventors:
NISHIKAWA AKIO
YOKONO ATARU
MUKAI JIYUNJI
Application Number:
JP11927974A
Publication Date:
November 17, 1976
Filing Date:
October 18, 1974
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
C08L29/00; C08G18/00; C08G18/58; C08G73/00; C08G73/06; C08L29/14; C08L75/04; C08L79/00; C08L79/04; C09J129/14; C09J175/00; (IPC1-7): C08G18/58; C08L29/14; C08L75/04; C09J3/14; C09J3/16
Domestic Patent References:
JPS471495A
JPS4830798A1973-04-23



 
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