Title:
HEAT-CURABLE EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2010043288
Kind Code:
A
Abstract:
To provide a novel single component heat-cured composition, especially adhesive and hot-melt adhesive stable at room temperature, having high strength on the one hand, and having high glass transition temperature advantageous in the glass transition temperature of at least 85C on the other.
The composition containing at least one (A) epoxy resin with on average more than 1 epoxy group, at least one (B) epoxy adduct with on average more than 1 epoxy group, at least one (C) thixotropic agent based on a urea derivative in a non-diffusing support material, and at least one (D) epoxy resin hardener which is activated by an increased temperature, is prepared.
Inventors:
KRAMER ANDREAS
Application Number:
JP2009267958A
Publication Date:
February 25, 2010
Filing Date:
November 25, 2009
Export Citation:
Assignee:
SIKA SCHWEIZ AG
International Classes:
C08G59/50; C08G18/10; C08G18/80; C08G59/20; C08G59/38; C08L63/00; C08L75/04; C09J151/00; C09J163/00; C09J163/02; C09J175/00; C09J175/04; C09J175/12; C09K3/10; C08L75/00; C08L75/12
Domestic Patent References:
| JP2003096266A | 2003-04-03 | |||
| JP2003226815A | 2003-08-15 | |||
| JP2002012850A | 2002-01-15 | |||
| JPH06508650A | 1994-09-29 |
Attorney, Agent or Firm:
Yasuhiko Murayama
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro
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