PURPOSE: To obtain the heat dissipating structure of a semiconductor device which is able to dissipate enough heat released from a power IC, easy to mount, and low in cost by a method wherein a plate piece of metal or ceramic excellent in thermal conductivity is bonded to the rear side of an IC with and adhesive agent of silicone, and heat released from the IC is transferred to the plate piece or a case or the like through the plate piece.

CONSTITUTION: Outer leads are bonded by soldering to an IC TAB-mounted on rigid board 2, a silicone adhesive agent 3 is applied onto the rear of the IC, a plate piece 1 of metal or ceramic is bonded thereto, and heat released from the IC is discharged to a heat dissipating plate of the metal or ceramic plate 1 through the intermediary of the silicone adhesive agent.