Title:
SEALING CAP OF PLASTIC PGA
Document Type and Number:
Japanese Patent JPH02276263
Kind Code:
A
Abstract:
PURPOSE: To obtain the sealing cap of a PPGA high in adhesive strength to the filled resin by a method wherein protrusions fixed by sealing resin are provided inside the sealing cap.
CONSTITUTION: A sealing cap 1 is provided with protrusions 2 inside it, and they support a filled resin 3 and the sealing cap 1. Pins 5 are implanted in a board 4, a semiconductor chip 6 is bonded to the board 4, and a circuit built in the board is brought into electric contact with the semiconductor chip 6 with a bonding wire T. Then, the sealing cap 1 is fixed to the board 4 by bonding through the intermediary of the filled resin 3.
Inventors:
TAKADO TSUMORU
Application Number:
JP9801089A
Publication Date:
November 13, 1990
Filing Date:
April 17, 1989
Export Citation:
Assignee:
KYUSHU NIPPON ELECTRIC
International Classes:
H01L23/04; H01L23/02; (IPC1-7): H01L23/04
Domestic Patent References:
| JPS4979468A | 1974-07-31 | |||
| JPS63291439A | 1988-11-29 |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)
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