Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HEAT PUMP
Document Type and Number:
Japanese Patent JP2015081765
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a heat pump, particularly the heat pump mounted with a plurality of heat exchange sections.SOLUTION: A heat pump comprises: a compressor; a cooling-heating switch valve; an indoor heat exchanger; a first expansion valve; and an outdoor heat exchanger. The outdoor heat exchanger has: a front row heat exchanger which is connected to the first expansion valve on a cooling medium flow passage and exchanges heat with outdoor air; a rear row heat exchanger which is connected to the cooling-heating switch valve on the cooling medium flow passage, positioned at a downstream side of the front row heat exchanger in a flow direction of the outdoor air and exchange heat with the outdoor air with heat thereof exchanged in the front row heat exchanger; a connection flow passage which connects the front row heat exchanger and the rear row heat exchanger; and a second expansion valve which is installed on the connection flow passage. Thus, the heat pump has an advantage of enabling both cooling performance and heating performance to be improved with the minimum number of components and a simple structure.

Inventors:
JIN GEUNHO
SEO KIWON
HA JONGCHUL
PARK MIN SOO
Application Number:
JP2014215977A
Publication Date:
April 27, 2015
Filing Date:
October 23, 2014
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
LG ELECTRONICS INC
International Classes:
F25B40/02; F24F11/02; F25B1/00; F25B13/00; F25B39/04; F25B41/20; F25B41/31; F28D1/047; F28D1/053; F28F9/26
Domestic Patent References:
JP2002372320A2002-12-26
JPS55126165U1980-09-06
JP2000205684A2000-07-28
JP2010159926A2010-07-22
JP2012255611A2012-12-27
Foreign References:
US20130091882A12013-04-18
Attorney, Agent or Firm:
Atsushi Aoki
Jun Tsuruta
Tomohiro Minamiyama
Akira Kawai
Kenichi Nakamura