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Patent Searching and Data


Title:
HEAT-RESISTANT HEAT DISSIPATION SHEET
Document Type and Number:
Japanese Patent JP2010232535
Kind Code:
A
Abstract:

To provide a heat-resistant heat dissipation sheet hardly deteriorated, and capable of keeping sufficient flexibility even when used at high temperature of 250-300°C.

This heat-resistant heat dissipation sheet contains a binder formed of a rubber-like elastic body having a fluorinated polyether skeleton as a main chain, and a thermally-conductive filler. The heat-resistant heat dissipation sheet is manufactured by mixing a liquid fluorinated polyether and the thermally-conductive filler with each other and thereafter reactively hardening them, and the 10% compressive load of the sheet is ≤100 N/cm2.


Inventors:
SHIMOYAMA NAOYUKI
FUKAWA YUHIKO
Application Number:
JP2009080232A
Publication Date:
October 14, 2010
Filing Date:
March 27, 2009
Export Citation:
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Assignee:
POLYMATECH CO LTD
International Classes:
H05K7/20; C08J5/18; C08K3/00; C08L71/00; H01L23/36; C08K3/14; C08K3/22; C08K3/28
Attorney, Agent or Firm:
Hironobu Onda
Makoto Onda