Title:
HEAT RESISTANT SYNTHETIC RESIN FILM WITH COMPOSITE METAL LAYER AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3201489
Kind Code:
B2
Abstract:
PURPOSE: To obtain substantially without curl by so forming that a thin metal film layer having a special value or less of a resistance value is provided on at least one side surface of a heat resistant synthetic resin layer and a conductive metal layer is provided further thereon.
CONSTITUTION: A thin metal film layer having a resistance value of 10Ω.cm or less is provided at least on one side surface of a heat resistant synthetic resin layer, and a conductive metal layer is provided further thereon. For example, polyparabanic acid resin dissolved in dimethylformamide is so cost in a film having a thickness of 10μm on a nickel-deposited surface of a polyethylene terephthalate film having a thickness of 100μm formed of nickel 500&angst thick by a vacuum depositing method, dried, then peeled from the terephthalate film, and the nickel deposited layer is transferred to the polyparabanic acid film side. Then, copper of 8μm is adhered to the polyparabanic acid film with the nickel-deposited layer in copper pyrophosphate plating bath to obtain a heat resistant film having a composite metal layer.
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Inventors:
Rinjiro Ichikawa
Junichi Hirata
Keisuke Ebina
Shunichi Doi
Junichi Hirata
Keisuke Ebina
Shunichi Doi
Application Number:
JP28360191A
Publication Date:
August 20, 2001
Filing Date:
October 03, 1991
Export Citation:
Assignee:
Fujimori Industry Co., Ltd.
Tonen Chemical Co., Ltd.
Mitsubishi Rayon Co., Ltd.
Tonen Chemical Co., Ltd.
Mitsubishi Rayon Co., Ltd.
International Classes:
H01L21/60; B32B15/08; B32B15/09; (IPC1-7): H01L21/60
Domestic Patent References:
| JP3116847A | ||||
| JP3222444A | ||||
| JP2219636A |
Attorney, Agent or Firm:
Eiji Tomomatsu (1 person outside)