Title:
HEAT-SEALING THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3489349
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a heat-sealing resin composition having good low- temperature heat-sealing properties, moldability and blocking resistance.
SOLUTION: This heat-sealing thermoplastic resin composition comprises the following components (a), (b), (c), (d) and (e) (where these five components amount to 100wt.%): (a) 20-70wt.% of an ethylene-α-olefin copolymer resin of ≤0.915 density, (b) 10-50wt.% of an olefinic elastomer, (c) 10-50wt.% of a styrene elastomer, (d) 5-60wt.% of a modified olefin polymer prepared by graft polymerization of 70-5wt.% of vinyl monomers onto 30-95wt.% of an olefinic polymer, and (e) 5-30wt.% of a tackifier.
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Inventors:
Hiroyuki Sato
Hiroyuki Nakayama
Yoshinobu Yada
Hiroyuki Nakayama
Yoshinobu Yada
Application Number:
JP26318496A
Publication Date:
January 19, 2004
Filing Date:
October 03, 1996
Export Citation:
Assignee:
Mitsubishi Chemical Corporation
International Classes:
C08L23/08; C08L23/16; C08L25/10; C08L51/06; C08L53/02; C08L57/02; C08L93/04; (IPC1-7): C08L23/08; C08L23/16; C08L51/06; C08L53/02
Domestic Patent References:
| JP5314752A | ||||
| JP5761034A | ||||
| JP5857479A | ||||
| JP619448A | ||||
| JP7149843A | ||||
| JP7309980A | ||||
| JP83231A | ||||
| JP1087908A |
Attorney, Agent or Firm:
Koji Hasegawa