Title:
熱処理装置
Document Type and Number:
Japanese Patent JP4371260
Kind Code:
B2
Abstract:
In a thermal processing apparatus ( 1 ), an upper opening ( 60 ) is closed by a transparent plate ( 61 ) and a light emitting part ( 5 ) emits light through the upper opening ( 60 ). Also provided are a susceptor ( 72 ) for supporting a substrate ( 9 ), a hot plate ( 71 ) for heating the susceptor ( 72 ) and a cover member ( 21 ) between the transparent plate ( 61 ) and the susceptor ( 72 ). The susceptor ( 72 ) has a recessed portion whose depth is larger than the thickness of the substrate ( 9 ), a lower surface of the substrate ( 9 ) is supported by a bottom surface of the recessed portion, and a periphery of the substrate ( 9 ) is surrounded by the side wall portion of the recessed portion. During processing of the substrate ( 9 ), the cover member ( 21 ) is moved down and brought into contact with an upper end of the side wall portion to close the recessed portion. Thus the periphery of the substrate ( 9 ) is blocked, so that even if the substrate ( 9 ) is broken during processing, the pieces of the substrate are prevented from being scattered.
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Inventors:
Akihiro Hosokawa
Application Number:
JP2003400964A
Publication Date:
November 25, 2009
Filing Date:
December 01, 2003
Export Citation:
Assignee:
Dainippon Screen Mfg. Co., Ltd.
International Classes:
F27B17/00; H01L21/26; F27D5/00; H01L21/683; H01L21/00; H01L21/22; H01L21/265; H01L21/324
Domestic Patent References:
| JP2003133249A | ||||
| JP200544881A |
Foreign References:
| WO2002095795A2 |
Attorney, Agent or Firm:
Masahiro Matsusaka