Title:
熱処理フラワー
Document Type and Number:
Japanese Patent JP5480282
Kind Code:
B2
Abstract:
A method for heat-treating flour comprising the steps of dehydrating the flour to minimize or avoid gelatinization, and heat treating the dehydrated flour. The resulting flour has increased moisture absorption. Dough made from the heat-treated flour has improved performance and baked goods made from the heat-treated flour have improved properties relative to dough and baked goods made from untreated flour.
Inventors:
Upletti, Plavin
Roberts, John, S.
Jalali, Lohit
Roberts, John, S.
Jalali, Lohit
Application Number:
JP2011531210A
Publication Date:
April 23, 2014
Filing Date:
October 09, 2009
Export Citation:
Assignee:
Rich Products Corporation
International Classes:
A21D6/00; A21D13/00; A23L5/30; A23L7/10
Domestic Patent References:
| JP7041503A | ||||
| JP2003134990A | ||||
| JP2004129607A | ||||
| JP2006025788A |
Foreign References:
| US5433966 | ||||
| US6616957 | ||||
| WO2007122730A1 |
Attorney, Agent or Firm:
Patent Business Corporation Minori Patent Office