Title:
熱処理システム及び熱処理装置
Document Type and Number:
Japanese Patent JP6826166
Kind Code:
B2
Abstract:
To provide a heat treatment system and a heat treatment device for a substrate, which can greatly reduce a space for installing a heater in the main body and a space for holding/managing, thereby increasing the space utilization.SOLUTION: A heat treatment system S includes a plurality of heat treatment devices 100 including a main body that provides a heat treatment space for a substrate and a plurality of heaters (main heater 210, auxiliary heater 220) provided inside the main body and having a length smaller than the width of the main body. A distance between the adjacent heat treatment devices is equal to or longer than the length of the heater included in the heat treatment device, and smaller than the width of the heat treatment device.SELECTED DRAWING: Figure 6
Inventors:
Choi, Wooyoung
Kim, Gunho
Kim, Nam Kyung
Kim, Gunho
Kim, Nam Kyung
Application Number:
JP2019145071A
Publication Date:
February 03, 2021
Filing Date:
August 07, 2019
Export Citation:
Assignee:
WONIK IPS CO.,LTD.
International Classes:
H01L21/324; F27B17/00; F27D3/06; F27D11/02
Domestic Patent References:
| JP10149994A | ||||
| JP2015162677A | ||||
| JP2011528501A | ||||
| JP2013539600A |
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Kato Kazunori