Title:
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
Japanese Patent JP2020027973
Kind Code:
A
Abstract:
To provide a high frequency module that ensures the flatness of a mounting substrate while increasing heat dissipation.SOLUTION: A high frequency module 1 includes: a transmission power amplifier 11; a bump electrode 13 connected to the transmission power amplifier 11; and a mounting substrate 90 on which the transmission power amplifier 11 is mounted. The mounting substrate 90 includes: a substrate body 90B formed of an insulating material; and a via conductor 91 inside the mounting substrate 90 and having a long shape when the mounting substrate 90 is viewed in plan. The bump electrode 13 and the via conductor 91 are connected in a state of at least partly being overlapped in the plan view, and an insulation portion 90C made of the insulating material of the substrate body 90B is disposed inside the via conductor 91.SELECTED DRAWING: Figure 2B
Inventors:
NAKAZAWA KATSUYA
UEJIMA TAKANORI
TSUDA MOTOTSUGU
TAKEMATSU YUJI
NAKAGAWA MASARU
HARADA TETSUO
TAKEBE MASAHIDE
MATSUMOTO NAOYA
SUKEMORI YOSHIAKI
SAMATA MITSUNORI
SASAKI YUTAKA
FUKUDA YUKI
UEJIMA TAKANORI
TSUDA MOTOTSUGU
TAKEMATSU YUJI
NAKAGAWA MASARU
HARADA TETSUO
TAKEBE MASAHIDE
MATSUMOTO NAOYA
SUKEMORI YOSHIAKI
SAMATA MITSUNORI
SASAKI YUTAKA
FUKUDA YUKI
Application Number:
JP2018150622A
Publication Date:
February 20, 2020
Filing Date:
August 09, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
H04B1/52; H01L23/12; H01L23/36; H04B1/00; H04B1/56
Attorney, Agent or Firm:
Shuichi Yoshikawa
Masao Sakajima
Masao Sakajima