To provide a small size and low cost high frequency module and manufacture thereof which has an improved heat dissipation efficiency for a mounting board and entirely shielded surface of module.
The module comprises a module board having insulation material portions at the periphery of outer input/output terminals 11 and desired area and thermally and electrically conductive material portions 10, semiconductor elements 30a, 30b on this board, and shield caps 40 which have spaces at desired area and are connected to the board through a thermally and electrically conductive material 23 and to the back sides of the elements 30a, 30b through a thermally and electrically conductive material 31. A plurality of the module boards are mode as one board. After mounting the elements 30a, 30b and caps 40, the modules are divided by dicing. Thus, high frequency modules each having a small size and high heat dissipation efficiency to the mounting board and immune to the noise are produced at a low cost by the mass production.
YAMASHITA KIICHI
YAMADA KOJI
YAMAZAKI MATSUO
TAKAHASHI AKIO
MATSUMOTO KUNIO
MIYAZAKI MASARU
