HIGH FREQUENCY PACKAGE MODULE

Japanese Patent JP3837699

B2

PROBLEM TO BE SOLVED: To prevent cracks on a dielectric substrate and resonance between input and output lines, and to improve the radiation characteristics of a semiconductor circuit chip in a high frequency package module with the flip chip package of semiconductor circuit chips.
SOLUTION: In the high frequency package module with the flip chip package of semiconductor circuit chips 1 on a dielectric substrate 3, on the surface of the dielectric substrate 3 opposite to the surface to package the semiconductor circuit chip 1 and in the area opposed to the semiconductor circuit chip 1, a plurality of land patterns 8 are formed in the size of ≤1/2 wavelength λof the operating frequency of the semiconductor circuit chip 1 and in the area of the dielectric substrate 3 to package the semiconductor circuit chip 1, and a plurality of through holes filled with metals can be formed at the interval of ≤λ/4.

JP5256083	A device that can be electrically insulated at the same time as thermal cooling
WO/2023/129313	CLOCK-GATING IN DIE-TO-DIE (D2D) INTERCONNECTS

Toshihiro Shimura
Yoji Ohashi

JP2001268330A

October 25, 2006

September 05, 2001

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富士通株式会社

H01L23/12; (IPC1-7): H01L23/12

JP2002334952A
JP2000022042A

Manabe Kiyoshi
Shoji Kashiwaya
Koichi Watanabe
Toshiro Ito

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