To provide a high frequency unit for mitigating thermal stress on an electronic component by reducing the times of reflow in manufacturing.
The high frequency unit 1A includes: a mother substrate 10; a high frequency module 100 mounted on the mother substrate 10; a shield case 60 covering the high frequency module 100 and fixed to the mother substrate 10; and a substantially Z-shaped support member 50 arranged between the high frequency module 100 and the shield case 60. The high frequency module 100 includes: the electronic components 40a-40d constituting a high frequency circuit; and a module substrate 30 with the electronic components 40a-40d mounted thereon. The lower end of the substantially Z shape support member 50 is joined with the module substrate 30 by soldering, and the upper end is brought into pressure contact with the shield case 60.
COPYRIGHT: (C)2010,JPO&INPIT
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Nobuo Arakawa