PURPOSE: To reduce the dispersion of a plating thickness as well as to improve plating unevenness, plating burning and so on by a method wherein the form of anodes is formed into a form coincided with the form of the surface to be plated of a material to be plated.

CONSTITUTION: The title device is provided with plating solution injection nozzles 1 consisting of heat-resisting vinyl chloride, screw parts 2 and 5, which are provided on each nozzle 1 and are used for attaching and detaching anodes and adjusting the anode-cathode distance, anode surfaces 4, which are provided on the upper surfaces of blocks (anode supporting parts) 3 and consist of a stainless plate, and so on. The device has such a structure that the anodes 4 are formed into a form coincided with the form of the surface to be plated of a material to be plated and can be attached and detached to and from the nozzles 1, and moreover, the anodes 4 are movably designed to be able to change the anode-cathode distance. Thereby, such poor appearance as plating unevenness and plating burning are improved off and a plating of stable quality can be obtained.