Title:
SEMICONDUCTOR MANUFACTURING DEVICE
Document Type and Number:
Japanese Patent JPS63263753
Kind Code:
A
Abstract:
PURPOSE: To make it possible to execute easily and reliably the work for fixing a parts on a soldering part while a soldering iron is held by a method wherein a solder fusing pool is provided in part of the surface of a hot plate provided for heating a semiconductor device.
CONSTITUTION: A recess is formed in part of the surface of a hot plate 1 for preheating a semiconductor device and a solder fusing pool 7 for ready-fusing a solder is provided. As a fused solder is always prepared in the pool 7 in an immediately usable state, a soldering work can be executed by both hands by using the solder in this pool 7. Thereby, working efficiency is improved.
Inventors:
HIRASE KUNIHISA
Application Number:
JP10060787A
Publication Date:
October 31, 1988
Filing Date:
April 22, 1987
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B23K3/06; H01L23/50; (IPC1-7): B23K3/06; H01L23/50
Attorney, Agent or Firm:
Masuo Oiwa
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