HIGHLY DIELECTRIC SUBSTANCE COMPOSITION

Title:

HIGHLY DIELECTRIC SUBSTANCE COMPOSITION

Document Type and Number:

Japanese Patent JP2004067889

Kind Code:

A

Abstract:

To obtain a highly dielectric substance composition comprising an inorganic filler and a resin, especially having a high dielectric constant of ≥40 and exhibiting characteristics suitable for a capacitor and a circuit board material having a function as a capacitor.

This highly dielectric substance composition comprising the inorganic filler and the resin is a composition regulated so that the standard deviation exhibiting dispersion of contents of the inorganic filler present in unit volumes is ≥4 in the distribution of the inorganic filler in the composition. In another aspect, the highly dielectric substance composition comprising the inorganic filler and the resin is a one regulated so that the ratio of the maximum value to the minimum value of the contents of the inorganic filler present in the unit volumes is ≥1.3 in the distribution of the inorganic filler in the composition.

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Inventors:

YAMAHO YUKA
HARA YOSHITAKE
KAWASAKI MANABU

Application Number:

JP2002229840A

Publication Date:

March 04, 2004

Filing Date:

August 07, 2002

Export Citation:

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Assignee:

TORAY INDUSTRIES

International Classes:

C08L101/00; C08K3/00; H01B3/00; H01G4/20; (IPC1-7): C08L101/00; C08K3/00; H01G4/20

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