Title:
HIGHLY HEAT-CONDUCTIVE CONDUCTOR, AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2013254837
Kind Code:
A
Abstract:
To develop a new highly heat-conductive filler, and to adopt the filler for a highly heat-conductive conductor.
The highly heat-conductive conductor comprises: crystalline silicon powder; and a matrix material. It is preferable that the highly heat-conductive conductor has a thermal conductivity (HC) which is equal to or larger than a value determined from the following formula (1) depending on the content (Cf) of a thermal conductive filler including the crystalline silicon powder: HC(W/mK)≥(Cf(mass%)/50(mass%))×0.92(W/mK) (1). The highly heat-conductive conductor can be manufactured by cleaning silicon cake resulting from the slicing of a crystalline silicon ingot, and then mixing with the matrix material, for example.
Inventors:
MATOBA NAOKI
TAKEUCHI MASAMI
TAMADA MASAHIRO
MURAKAMI HIROYUKI
TAKEUCHI MASAMI
TAMADA MASAHIRO
MURAKAMI HIROYUKI
Application Number:
JP2012129339A
Publication Date:
December 19, 2013
Filing Date:
June 06, 2012
Export Citation:
Assignee:
KANSAI COKE & CHEMICALS
MC EVOLVE TECHNOLOGIES CORP
CHIYODA TRADING CORP
MC EVOLVE TECHNOLOGIES CORP
CHIYODA TRADING CORP
International Classes:
H01L23/373
Attorney, Agent or Firm:
Kyuichi Ueki
Hisahiko Ueki
Tadashi Sugakawa
Hiroaki Ito
Hisahiko Ueki
Tadashi Sugakawa
Hiroaki Ito