Title:
HIGHLY HEAT RESISTING ELECTROCONDUCTIVE POLYCARBONATE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2007332386
Kind Code:
A
Abstract:
To provide a highly heat resisting electroconductive polycarbonate resin composition having good heat resistance, excellent in electroconductivity and causing no irritation to the skin.
The polycarbonate resin composition comprises (A) a polycarbonate copolymer, which comprises 20-95 mol% 9,9-bis(4-hydroxy-3-methylphenyl)fluorene and 95-20 mol% aromatic dihydroxy component based on whole aromatic dihydroxy component, and (B) a carbon-based filler.
COPYRIGHT: (C)2008,JPO&INPIT
Inventors:
IKEDA YUKINORI
TOKUDA TOSHIMASA
TOKUDA TOSHIMASA
Application Number:
JP2007218385A
Publication Date:
December 27, 2007
Filing Date:
August 24, 2007
Export Citation:
Assignee:
TEIJIN CHEMICALS LTD
International Classes:
C08L69/00; C08G64/04; C08K3/04
Domestic Patent References:
JPH11306823A | 1999-11-05 | |||
JP2001206944A | 2001-07-31 | |||
JP2001240666A | 2001-09-04 | |||
JPH07268197A | 1995-10-17 | |||
JPH1135815A | 1999-02-09 | |||
JP2000007906A | 2000-01-11 | |||
JP2001200153A | 2001-07-24 |
Foreign References:
WO2000026705A1 | 2000-05-11 |
Attorney, Agent or Firm:
Hideko Mihara
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