To provide a highly thermally conductive composition which is fluid ized at a prescribed temperature and has an excellent heat radiation property and low thermal conductive resistance, and a heat radiation member which is microscopically bonded to the joint surfaces of a heat generating electronic member and a heat radiation film.
The highly thermally conductive composition is prepared by mixing a wax and/or a paraffin having a melting point of from 40 to 100°C, a flexibility-imparting material and a magnesium or calcium borate particle coated with hexagonal boron nitride. A heat-dissipating member of a heat- dissipating electronic member and a heat-dissipating fin integrated with a heat- dissipating electronic member are prepared using this highly thermally conductive composition.
KAWASAKI TAKU
SAWA HIROAKI
