Title:
Honeycomb structural body
Document Type and Number:
Japanese Patent JP5992857
Kind Code:
B2
Abstract:
There is disclosed a honeycomb structure which can be used as a catalyst carrier and also functions as a heater when a voltage is applied thereto and which has excellent heat shock resisting properties. A honeycomb structure 100 includes a tubular bonded honeycomb segment assembly 4 having a plurality of honeycomb segments 6 and a bonding layer 7 which bonds side surfaces of the plurality of honeycomb segments 6 to each other; and a pair of electrode members 21 disposed on a side surface of the bonded honeycomb segment assembly 4, a volume resistivity of each of the honeycomb segments 6 is from 1 to 200 ©cm, at least a part of the bonding layer 7 is made of a bonding material having a conductivity, a volume resistivity of the bonding layer 7 is from 2 to 2000 ©cm, and each of the pair of electrode members 21 is formed into a band-like shape extending in an extending direction of the cells of the bonded honeycomb segment assembly 4, and one electrode member 21 is disposed on a side opposite to the other electrode member 21 via a center of the bonded honeycomb segment assembly 4.
Inventors:
Omiya Yoshimasa
Atsushi Kaneda
Kazuya Mase
Atsushi Kaneda
Kazuya Mase
Application Number:
JP2013074936A
Publication Date:
September 14, 2016
Filing Date:
March 29, 2013
Export Citation:
Assignee:
Nippon Insulator Co., Ltd.
International Classes:
B01J35/04; B01D53/94; B01J27/224; B01J32/00; C04B37/00; C04B38/06; F01N3/20; F01N3/28
Domestic Patent References:
| JP2012214364A | ||||
| JP2012092820A | ||||
| JP2010229976A |
Attorney, Agent or Firm:
Ippei Watanabe
Koji Kikawa
Hiroyuki Sato
Shigeru Koike
Koji Kikawa
Hiroyuki Sato
Shigeru Koike