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Title:
HOT-MELT ADHESIVE
Document Type and Number:
Japanese Patent JP2012233119
Kind Code:
A
Abstract:

To provide a hot-melt adhesive that has superior low-temperature adhesion, does not make an adhesive layer and adhesive film formed thereof sticky at room temperature, and sufficiently prevents burrs from being produced during a punching process.

The hot-melt adhesive contains an acid-modified polyolefin resin and a copolyester resin, wherein the content of the copolyester resin is 1-20 parts by weight based on 100 parts by weight of the acid-modified polyolefin resin.


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Inventors:
AOKI TOMOYUKI
FUJIWARA KEI
Application Number:
JP2011103796A
Publication Date:
November 29, 2012
Filing Date:
May 06, 2011
Export Citation:
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Assignee:
KURASHIKI BOSEKI KK
International Classes:
C09J123/30; C09J7/00; C09J167/00; C09J167/02
Domestic Patent References:
JPH11315257A1999-11-16
JPS5214683A1977-02-03
JPS4540678B1
JP2004318605A2004-11-11
JP2009110988A2009-05-21
Attorney, Agent or Firm:
Samejima Mutsumi
Kyousei Tamura
Kitahara Yasuhiro



 
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