Title:
POLYOXYMETHYLENE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2012233120
Kind Code:
A
Abstract:
To provide a resin composition having practically sufficient heat resistance, biodegradability, mechanical characteristics, and in particular, excellent toughness.
In the polyoxymethylene resin composition consisting of a polyoxymethylene copolymer, polyglycolic acid and polylactic acid, a weight ratio (polyoxymethylene copolymer/polyglycolic acid) of the polyoxymethylene copolymer to the polyglycolic acid is from 20/80 to 80/20, and a weight ratio (a total amount of polyoxymethylene copolymer and polyglycolic acid/polylactic acid) of the total amount of the polyoxymethylene copolymer and the polyglycolic acid to the polylactic acid is from 100/0 to 66/34.
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Inventors:
ITO AKIRA
HIRANO TOMOYUKI
HIRANO TOMOYUKI
Application Number:
JP2011103916A
Publication Date:
November 29, 2012
Filing Date:
May 08, 2011
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO
KUREHA CORP
KUREHA CORP
International Classes:
C08L59/00; C08K5/29; C08L67/04; C08L101/16