To provide a hot melt adhesive which can exhibit excellent low- temperature adhesiveness even to a polyolefin material not subjected to preheating or surface treatment.

This invention provides a hot melt adhesive consisting mainly of an ethylene/acrylic ester copolymer (a) and a tackifying resin (b), wherein the copolymer (a) comprises an ethylene/acrylic ester copolymer having an acrylic ester content of 1 to below 12mol% and an ethylene/acrylic ester copolymer having an acrylic ester content of 12 to below 30mol% in a ratio of 10:90 to 90:10 by weight. The copolymer (a) comprises an ethylene/ethyl acrylate copolymer and/or an ethylene/butyl acrylate copolymer.