マイクロ電気機械システム装置を形成する方法

Title:

マイクロ電気機械システム装置を形成する方法

Document Type and Number:

Japanese Patent JP5872278

Kind Code:

B2

Abstract:

A device includes a substrate (308) and a metallic layer (336) formed over the substrate (308) with a deposition process for which the metallic layer (336) is characterizable as having a pre-determinable as-deposited defect density. As a result of a fabrication process, the defect density of the metallic layer (336) is reduced relative to the pre-determinable as-deposited defect density of the same layer (336) or another layer having like composition and which is formed under like deposition conditions. In a related method, a substrate (308) is provided and a removable layer (330) is formed over the substrate (308). A metallic layer (336) is formed over the removable layer (330) and is patterned and etched to define a structure over the removable layer (330). The removable layer (330) is removed, and the metallic layer (336) is heated for a time beyond that necessary for bonding of a hermetic sealing cap (340) thereover.

Inventors:

Andrew Joseph Dito
Lead coderman
Christopher Kamel
Marco Aimi

Application Number:

JP2011275135A

Publication Date:

March 01, 2016

Filing Date:

December 16, 2011

Export Citation:

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